PVD Copper Coating on Glass Substrates

As the semiconductor industry evolves, Glass Core Substrates have become a core material platform for 2.5D/3D advanced packaging, CPO (co-packaged optics), and high-frequency RF devices. However, there is a major physical challenge: copper has inherently poor adhesion to glass.

We use advanced PVD (physical vapor deposition) magnetron sputtering technology to successfully solve the copper adhesion challenge on glass substrates.

• Through our proprietary semiconductor coating technology, we have developed two unique processes: precision PVD sputtering coating and high-adhesion coating.
• PVD copper thickness can reach up to 10 µm.
• For ultra-thin glass after copper coating, we can solve the problem of residual stress inside the metal thin film, which causes severe warpage or even breakage of ultra-thin glass (such as 0.05T TFT glass).
• Whether for small-size glass wafers or large-size glass panels, our magnetron sputtering can achieve uniform copper film thickness.
• After our PVD coating, the film layer features strong stability, high hardness, high wear resistance, high corrosion resistance, strong chemical stability, and long film life. The coating process is non-toxic and does not generate pollutants.

After PVD copper coating, we use in-house PI slurry synthesis for coating and curing to protect the copper circuits, providing insulation, stress control, and prevention of signal crosstalk. We use high-precision spin coating technology to achieve precise control of the PI film layer.

• PI is currently the most heat-resistant polymer material that can be practically applied, while also maintaining good performance at low temperatures. It remains stable without deformation over the long term in the range of -269°C to 280°C.
• PI material demonstrates excellent performance in processability, mechanical properties, insulation, flame retardancy, chemical corrosion resistance, radiation resistance, and many other aspects.