From Precision Glass Machining to TGV and Metallization: One-Stop Manufacturing Capability for Advanced Packaging Glass Substrates
With the development of 2.5D/3D advanced packaging, CPO (Co-Packaged Optics), high-frequency RF, Mini/Micro LED, and glass microfluidics, glass substrates are becoming a core manufacturing platform. We are a precision glass substrate and metallization processing factory serving advanced packaging, with full-chain control capabilities covering thinning, cutting, via formation, metallization, passivation, and inspection/delivery.
Our current products include:
- Through-Glass Via (TGV) glass carrier substrates
- Glass Core Substrate (GCS)
- Co-Packaged Optics (CPO) & RF Substrates
- Glass Microfluidic Devices
- Mini/Micro LED Packaging Substrate
- Micro LED Glass Substrates
Precision Glass Machining Capabilities
We have stable glass thinning capabilities:
- TFT glass: 0.05T thinning capability
- 0.2T products: yield without polishing ≥99%, yield with polishing ≥98.5%
- Fingerprint modules: mass-production thinning performance ≥99% for 0.09T
Thinning is not only about reducing thickness; it also affects subsequent cutting, via formation, copper coating, and warpage control. Through process matching and yield management, we provide a stable incoming-material foundation for subsequent metallization of ultra-thin glass.
Cutting Types and Equipment
We support six combination schemes: all-wheel cutting, all-laser cutting, all-CNC processing, wheel + laser, wheel + CNC, and laser + CNC. We can match the process according to product characteristics, edge quality, precision polishing requirements, and capacity needs.
Cutting facility capabilities include:
- G5.5 line splitting capability; G5 products can be cut directly into small sizes
- Cutting capability for 0.05+0.05 mm ultra-thin products
- Complete supporting facilities for cutting/CNC/laser/electrical testing AOI and OLED
We are the first factory in China to carry out cutting equipment technical upgrading, achieving magnetic levitation cutting, automatic loading, and automatic flipping, and can meet precision polishing requirements of 15 μm. This capability helps improve cutting quality and automation stability for ultra-thin glass and high-end display/packaging glass.
TGV Glass Through-Via Capability
For TGV glass through-via carrier substrates and glass core substrates, we mainly use laser drilling to drill through-holes through the full thickness of the glass:
- Drilling on glass with thickness ranging from 50–2000 μm
- Minimum hole diameter down to 3 μm
- Maximum aspect ratio up to 150:1
Combined with our thinning, cutting, and PVD copper coating capabilities, TGV can be further integrated with seed layer/copper layer deposition, PI passivation, and inspection, providing a reliable RDL base for multi-chip integration.
Glass Substrate Quality Assurance and Delivery
We focus on “verifiable manufacturing capability”:
- Quality inspection can be integrated across thinning, cutting, via formation, copper coating, and passivation processes
- MES integration enables transparent production data for customers
- On-time delivery rate ≥99%, process yield ≥99%
- Self-owned logistics fleet for point-to-point customer service
- For ultra-thin glass, TGV, GCS, CPO/RF, and microfluidic projects, we provide engineering support from process evaluation and prototyping to small-batch validation
If you are looking for a glass substrate manufacturing partner that can shorten the supplier chain and improve project yield, we can provide customized process solutions of “Precision Glass Machining + TGV + PVD Cu + PI Passivation” around your project metrics. Please contact us.
